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Semiconductor Fabrication
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High-Adhesion Protective Film for Semi. Manufacturing Process

Description
High-Adhesion Protective Film for Semi. Manufacturing Process
  • No Adhesive Residue
型號 厚度結構(基材/黏著層/離型膜) 透光度 黏著力 表面阻抗(膠面) 表面阻抗(膜面)
CN10-1315 25/15/50 >89% 900±100g 1010 ~ 1012Ω/sq. >1012Ω/sq.