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Semiconductor Fabrication
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High-Adhesion Protective Film for Semi. Manufacturing Process

High-Adhesion Protective Film for Semi. Manufacturing Process
  • No Adhesive Residue
model Thickness structure(Substrate/Adhesive layer/Release film) Transmittance Adhesion Surface impedance (adhesive surface) Surface impedance (membrane surface)
CN10-1315 25/15/50 >89% 900±100g 1010 ~ 1012Ω/sq. >1012Ω/sq.
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