High-Adhesion Protective Film for Semi. Manufacturing Process
High-Adhesion Protective Film for Semi. Manufacturing Process
- No Adhesive Residue
model
Thickness structure(Substrate/Adhesive layer/Release film)
Transmittance
Adhesion
Surface impedance (adhesive surface)
Surface impedance (membrane surface)
CN10-1315
25/15/50
>89%
900±100g
1010 ~ 1012Ω/sq.
>1012Ω/sq.
High-Adhesion Protective Film for Semi. Manufacturing Process
- No Adhesive Residue
| model | Thickness structure(Substrate/Adhesive layer/Release film) | Transmittance | Adhesion | Surface impedance (adhesive surface) | Surface impedance (membrane surface) |
| CN10-1315 | 25/15/50 | >89% | 900±100g | 1010 ~ 1012Ω/sq. | >1012Ω/sq. |
