Thermal conductive material
LL3&LL5/LE Series
Product Features
Unit
LL3 series
LL5/LE series
Test Method
Thermal Conductivity
W/mK
3.0
5.0
ASTM E1461
Peel Strength
Kgf/cm
1.4
1.4
IPC-TM-650 2.4.8
Solder Float Heat Resistance [300℃]
min
5
5
IPC-TM-650 2.4.13
Breakdown Voltage
AC
KV
3
3
IPC-TM-650 2.5.6.2
DC
KV
6
6
Glass transition temp. [DMA 30~300℃]
℃
≧120
≧150
IPC-TM-650 2.4.25
Thermal Decomposition [TGA 5% weight loss]
℃
420
435
IPC-TM-650 2.3.41
Coefficient Of Thermal Expansion [TMA]
>Tg
ppm/℃
≦100
≦100
IPC-TM-650 2.4.24
<Tg
ppm/℃
≦60
≦60
Volume Resistivity@1000V
Ωcm
≧1014
≧1014
IPC-TM-650 2.5.17.1
Surface Resistivity@1000V
Ω
≧1012
≧1012
LA3&LA5 Series
Product Features
Unit
LA3 series
LA5 series
Test Method
Thermal Conductivity
W/mK
3.0
5.0
ASTM E1461
Thermal Resistance
℃cm2/W
0.46
0.37
ASTM D5470
Peel Strength
Kgf/cm
1.4
1.4
IPC-TM-650 2.4.8
Solder Float Heat Resistance [300℃]
min
5
5
IPC-TM-650 2.4.13
Breakdown Voltage
AC
KV
3
3
IPC-TM-650 2.5.6.2
DC
KV
6
6
Water Absorption [20℃/24hr immersion]
%
<1
<1
IPC-TM-650 2.6.2.1
Glass Transition Temp. [DMA]
℃
≧120
≧150
IPC-TM-650 2.4.25
Thermal Decomposition [TGA 5% weight loss]
℃
420
435
IPC-TM-650 2.3.41
Coefficient of Thermal Expansion [TMA]
>Tg
ppm/℃
≦100
≦100
IPC-TM-650 2.4.24
<Tg
ppm/℃
≦60
≦60
Remarks: The thickness of the adhesive can be provided according to customer requirements.
LL3&LL5/LE Series
| Product Features | Unit | LL3 series | LL5/LE series | Test Method | |
| Thermal Conductivity | W/mK | 3.0 | 5.0 | ASTM E1461 | |
| Peel Strength | Kgf/cm | 1.4 | 1.4 | IPC-TM-650 2.4.8 | |
| Solder Float Heat Resistance [300℃] | min | 5 | 5 | IPC-TM-650 2.4.13 | |
| Breakdown Voltage | AC | KV | 3 | 3 | IPC-TM-650 2.5.6.2 |
| DC | KV | 6 | 6 | ||
| Glass transition temp. [DMA 30~300℃] | ℃ | ≧120 | ≧150 | IPC-TM-650 2.4.25 | |
| Thermal Decomposition [TGA 5% weight loss] | ℃ | 420 | 435 | IPC-TM-650 2.3.41 | |
| Coefficient Of Thermal Expansion [TMA] | >Tg | ppm/℃ | ≦100 | ≦100 | IPC-TM-650 2.4.24 |
| <Tg | ppm/℃ | ≦60 | ≦60 | ||
| Volume Resistivity@1000V | Ωcm | ≧1014 | ≧1014 | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity@1000V | Ω | ≧1012 | ≧1012 | ||
LA3&LA5 Series
| Product Features | Unit | LA3 series | LA5 series | Test Method | |
| Thermal Conductivity | W/mK | 3.0 | 5.0 | ASTM E1461 | |
| Thermal Resistance | ℃cm2/W | 0.46 | 0.37 | ASTM D5470 | |
| Peel Strength | Kgf/cm | 1.4 | 1.4 | IPC-TM-650 2.4.8 | |
| Solder Float Heat Resistance [300℃] | min | 5 | 5 | IPC-TM-650 2.4.13 | |
| Breakdown Voltage | AC | KV | 3 | 3 | IPC-TM-650 2.5.6.2 |
| DC | KV | 6 | 6 | ||
| Water Absorption [20℃/24hr immersion] | % | <1 | <1 | IPC-TM-650 2.6.2.1 | |
| Glass Transition Temp. [DMA] | ℃ | ≧120 | ≧150 | IPC-TM-650 2.4.25 | |
| Thermal Decomposition [TGA 5% weight loss] | ℃ | 420 | 435 | IPC-TM-650 2.3.41 | |
| Coefficient of Thermal Expansion [TMA] | >Tg | ppm/℃ | ≦100 | ≦100 | IPC-TM-650 2.4.24 |
| <Tg | ppm/℃ | ≦60 | ≦60 | ||
Remarks: The thickness of the adhesive can be provided according to customer requirements.
