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Thermal conductive material
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Thermal conductive material

LTK/LTP/LAS/LA/LAX
Product Features Unit Spec. LTK  LTP LAS  LA LAX Test Method
Thermal conductivity W/mK   1.5 1.8 2.2 2.5 3.0 ASTM D5470
Thermal conductivity W/mK   2.8 3.2 5.5 6.3 8 E1461( Laser Flash) 
Thermal Resistance ℃cm²/W ≦1 0.4 0.38 0.36 0.34 0.28 ASTM D5470
Peel strength Kgf/cm ≧1.0 1.4 1.4 1.4 1.4 1.4 IPC-TM-650 2.4.8
Solder Float Heat Resistance [300℃] min >3 5 5 5 5 5 IPC-TM-650 2.4.13
Breakdown Voltage AC KV ≧3 4 4 4 4 4 IPC-TM-650 2.5.6.2
DC KV ≧3 5 5 5 5 5
Glass transition temp. [DMA 30~300℃]   130 150 180 190 200 IPC-TM-650 2.4.25
Thermal decomposition [TGA 5% weight loss] ≧350 380 380 420 420 420 IPC-TM-650 2.3.41
Coefficient of thermal expansion [TMA] >Tg ppm/℃ ≦120 53 53 48 48 38 IPC-TM-650 2.4.24
<Tg ppm/℃ ≦60 33 33 24 24 30
Dielectric constant @10GHz - <8 4.8 6.6 6.5 6.5 5.8 IPC-TM-650 2.5.5.9
CTI     >600 >600 >600 >600 >600  
MOT     130* 130* 130 130 130*  
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