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Thermal conductive material
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Thermal conductive material

LL3&LL5/LE Series
Product Features Unit LL3 series LL5/LE series Test Method
Thermal Conductivity W/mK 3.0 5.0 ASTM E1461
Peel Strength Kgf/cm 1.4 1.4 IPC-TM-650 2.4.8
Solder Float Heat Resistance [300℃] min 5 5 IPC-TM-650 2.4.13
Breakdown Voltage AC KV 3 3 IPC-TM-650 2.5.6.2
DC KV 6 6
Glass transition temp. [DMA 30~300℃] ≧120 ≧150 IPC-TM-650 2.4.25
Thermal Decomposition [TGA 5% weight loss] 420 435 IPC-TM-650 2.3.41
Coefficient Of Thermal Expansion [TMA] >Tg ppm/℃ ≦100 ≦100 IPC-TM-650 2.4.24
<Tg ppm/℃ ≦60 ≦60
Volume Resistivity@1000V Ωcm ≧1014 ≧1014 IPC-TM-650 2.5.17.1
Surface Resistivity@1000V Ω ≧1012 ≧1012
LA3&LA5 Series
Product Features Unit LA3 series LA5 series Test Method
Thermal Conductivity W/mK 3.0 5.0 ASTM E1461
Thermal Resistance ℃cm2/W 0.46 0.37 ASTM D5470
Peel Strength Kgf/cm 1.4 1.4 IPC-TM-650 2.4.8
Solder Float Heat Resistance [300℃] min 5 5 IPC-TM-650 2.4.13
Breakdown Voltage AC KV 3 3 IPC-TM-650 2.5.6.2
DC KV 6 6
Water Absorption [20℃/24hr immersion] % <1 <1 IPC-TM-650 2.6.2.1
Glass Transition Temp. [DMA] ≧120 ≧150 IPC-TM-650 2.4.25
Thermal Decomposition [TGA 5% weight loss] 420 435 IPC-TM-650 2.3.41
Coefficient of Thermal Expansion [TMA] >Tg ppm/℃ ≦100 ≦100 IPC-TM-650 2.4.24
<Tg ppm/℃ ≦60 ≦60


Remarks: The thickness of the adhesive can be provided according to customer requirements.
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