Thermal conductive material
LTK/LTP/LAS/LA/LAX
| Product Features | Unit | Spec. | LTK | LTP | LAS | LA | LAX | Test Method | ||
| Thermal conductivity | W/mK | 1.5 | 1.8 | 2.2 | 2.5 | 3.0 | ASTM D5470 | |||
| Thermal conductivity | W/mK | 2.8 | 3.2 | 5.5 | 6.3 | 8 | E1461( Laser Flash) | |||
| Thermal Resistance | ℃cm²/W | ≦1 | 0.4 | 0.38 | 0.36 | 0.34 | 0.28 | ASTM D5470 | ||
| Peel strength | Kgf/cm | ≧1.0 | 1.4 | 1.4 | 1.4 | 1.4 | 1.4 | IPC-TM-650 2.4.8 | ||
| Solder Float Heat Resistance [300℃] | min | >3 | 5 | 5 | 5 | 5 | 5 | IPC-TM-650 2.4.13 | ||
| Breakdown Voltage | AC | KV | ≧3 | 4 | 4 | 4 | 4 | 4 | IPC-TM-650 2.5.6.2 | |
| DC | KV | ≧3 | 5 | 5 | 5 | 5 | 5 | |||
| Glass transition temp. [DMA 30~300℃] | ℃ | 130 | 150 | 180 | 190 | 200 | IPC-TM-650 2.4.25 | |||
| Thermal decomposition [TGA 5% weight loss] | ℃ | ≧350 | 380 | 380 | 420 | 420 | 420 | IPC-TM-650 2.3.41 | ||
| Coefficient of thermal expansion [TMA] | >Tg | ppm/℃ | ≦120 | 53 | 53 | 48 | 48 | 38 | IPC-TM-650 2.4.24 | |
| <Tg | ppm/℃ | ≦60 | 33 | 33 | 24 | 24 | 30 | |||
| Dielectric constant @10GHz | - | <8 | 4.8 | 6.6 | 6.5 | 6.5 | 5.8 | IPC-TM-650 2.5.5.9 | ||
| CTI | >600 | >600 | >600 | >600 | >600 | |||||
| MOT | 130* | 130* | 130 | 130 | 130* | |||||
