FPC Heat Resistance Protective Film
FPC Heat Resistance Protective Film
- No Adhesive Residue after High Temperature
- Excellent Chemical Rresistance
model | Thickness structure (base material/adhesive layer/release film) | Transmittance | Adhesion | Surface impedance (adhesive surface) | Surface impedance (membrane surface) | High temperature resistance |
GAS-3115 | 50/15/25 | >89% | 6±3g | 109 ~ 1012Ω/sq. | >1012Ω/sq. | 150℃ / 2hrs |